3M Adhesive Tape 5413

Details

• The polyimide tape peels off surfaces with ease, as it does not soften at higher temperatures and remains dimensionally stable. This eliminates the need for post-processing, such as the removal of adhesive residue.
• This tape can protect surfaces from exposure to chemicals and UV radiation. It is also flame-retardant.
• Polyethylene core instead of cardboard
• The high temperature resistance of the silicone adhesive reduces adhesive leakage, eliminating the need for cleaning.

3M™ 5413 High-Temperature Polyimide Adhesive Tape consists of a polyimide film with silicone adhesive. This brown tape is 68.58 µm thick and can be used to mask printed circuit boards during the soldering process and for other low- and high-temperature applications, ranging from -73 °C to 260 °C.

The 3M™ 5413 High-Temperature Polyimide Adhesive Tape is designed for masking printed circuit boards during the soldering process and for other low- and high-temperature applications, ranging from -73 °C to 260 °C. This brown, 68.58 µm thick adhesive tape consists of a polyimide film with a silicone adhesive. Additionally, the roll core is made of polyethylene instead of cardboard. The high temperature resistance of the silicone adhesive reduces adhesive leakage, eliminating the need for cleaning and thereby increasing productivity.The polyimide adhesive tape peels off surfaces easily because it does not soften at higher temperatures and retains its shape. This eliminates the need for post-processing, such as the removal of adhesive residue. This adhesive tape can protect surfaces from exposure to chemicals and UV radiation. It is also flame-retardant.